Dr. Cheng-fu Chen Assistant Professor Department of Mechanical Engineering University of Alaska Fairbanks biosketch (pdf, 108 kb)	Phone: (907) 474-7265 Fax: (907) 474-6141 Office: 349C Duckering Building e-mail: ffcc@uaf.edu

(2/14/2004. I and Anastasia. She was not very happy because I grabbed her from the playground for taking this picture. Seen in the background is the Woodriver Elememtary School, Fairbanks, AK, where she will be attending in the fall of 2008.)

(This page was last updated on June 3, 2008.)

Cheng fu obtained his B.S. and M.S. degrees in Mechanical Engineering from the National Taiwan University and his Ph.D. degree in Mechanical Engineering from the University of Wisconsin, Madison in 2000. Dr. Chen's research, since he joined the UAF at the end of 2002, has been on the reliability of electronic packaging and the development of miniaturized microfluidic devices for microdialysis.

In the electronic packaging reliability project, Cheng-fu has been focusing on the influence of underfill filler settling on the lifetime of solder interconnects as well as on the distribution of the die/underfill interfacial stresses that have direct impact on die delamination/cracking. Currently he is working on the effects of acceleration and mechanical shock on electronic systems, particularly, 3D stacked chips. The research is aimed at improving the reliability of stacked Chip Scale Packaging (CSP) modules for commercial as well as space and military applications.

In the microfluidics project Cheng-fu has been working on the miniaturization of microdialysis in the past few years with Dr. Kelly Drew of IAB, a sampling technique to access to the extracellular space in tissues to sample molecular particles. Of some successful milestones he achieved include one pending patent.

Patent

• Cheng-fu Chen, Kelly L. Drew “ Digital microdialysis by operating droplets in a miniaturized probe,” provisional patent pending, July 20, 2006 (No. 60/831,924).

Refereed Journal Papers ( UAF students names are underlined)

• C.-f. Chen and K. L. Drew, “Droplet-based Microdialysis – Concept, Theory, and Design Consideration,” J. Chromatography, in review, 2008.
• C.-f. Chen and P. C. Karulkar, “Dependence of Flip Chip Solder Reliability on Filler Settling,” IEEE Trans. Advanced Packaging, in review, 2008.
• C.-f. Chen, “Effect of Underfill Filler Settling on Thermomechanical Fatigue Analysis of Flip-Chip Eutectic Solders,” in press, Microelectronics Reliability, 10.1016/j.microrel.2008.03.022, 2008.
• C.-f. Chen, D. C. Peterson, and P. C. Karulkar, “Underfill filler settling effect on the die backside interfacial stresses of flip chip packages,” accepted, ASME Transaction on Electronic Packaging, 2008.
• C.-f. Chen and J. Lee, “Heterogeneous-medium transport and propagation,” accepted for publication in the Encyclopedia of Nanoscience and Nanotechnology, Journal of Nanoscience and Nanotechnology. (2007)
• S. Guruzu, M. Kulkarni, S. Ingole, G. Xu, C.-f. Chen, H. Liang, “Friction induced crystalline phase on Si,” Wear, Vol. 259, pp. 524-528, 2005.
• A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Microfludic simulations for immersion lithography,” J. Microlithogr. Microfabrication, Microsyst., Vol. 3, pp. 28-34, 2004.
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay performance for electron-projection lithography mask,” J. Microlithogr. Microfabrication, Microsyst., Vol. 2, pp.148-156, 2003.
• C-.f. Chen , R. Engelstad, E. Lovell, D. White, O. Wood, M. Smith, and L. Harriott, “Adaptive alignment of photomasks for overlay improvement,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3099-3105, 2002
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, T. Bayer, J. Greschner, S. Kalt, H. Weiss, O. Wood, and R. Mackay, “ Electron projection lithography mask format layer stress measurement and simulation of pattern transfer distortion,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3053-3057, 2002.
• C.-f. Chen , R . Engelstad, E. Lovell, and A. Novembre , “Simulating the response of electron-beam projection lithography masks under standardized mounting techniques,” Journal of Vacuum Science and Technology B, Vol. 19 , pp 2646-2651, 2001.
• A. Jachim, C.-f. Chen , R. Engelstad, and E. Lovell , “ Simulating the mechanical response of electron-beam projection lithography masks ,” Journal of Vacuum Science and Technology B, 18, pp 3248-3253, 2000.

Refereed Conference Articles ( UAF students names are underlined)

• C.-f. Chen , “Constitutive law and quantification of miniaturized microdialysis,” The 6 th International Conference on Nanochannels, Microchannels and Minichannels, Darmstardt, Germany, June 23-25, 2008.
• D. Peterson, C.-f. Chen, and P. Karulkar, “Characterization of drop impact survivability of a 3D CSP stack module,” The 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008.
• C.-f. Chen , and P. Karulkar, “Influence of filler settling on the analysis of solder reliability of flip chip packaging,” The 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008.
• C.-f. Chen “Collision Detection of Moving Polygonal Mobile Robots,” Joint North America, Asia-Pacific ISTVS Conference and Annual Meeting of Japanese Society for Terramechanics, Fairbanks, AK, June 22-24, 2007.
• C.-f. Chen and N. K. Thammadi, “Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging,” 2006 11th International Symposium on Advanced Packaging Materials, March 15-17, Atlanta, GA. pp. 51-56.
• C.-f. Chen , N. K. Karri, and B. R. Bracio, “Influence of Electromigration on the Reliability of Micro Switches,” The Seventh VLSI Packaging Workshop of Japan Technical Digest, Kyoto, Japan, Nov. 30-Dec. 2, 2004, pp. 137-140.
• A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Preliminary microfluidic simulation for immersion lithography,” Proceedings of the 2003 SPIE Symposium on Emerging Lithography VI, Vol. 5040, pp. 713-723, 2003.
• C.-f. Chen , “Energy Efficient Routing for Clustered Wireless Sensors Network,” the 29th Annual Conference of the IEEE Industrial Electronics Society (IECON), Roanoke, VA, pp. 1437-1140, 2003.
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay and CD uniformity for the electron projection lithography mask,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 547-558, 2002.
• D. White, O. Wood, C.-f. Chen, E. Lovell, and R. Engelstad, “A complete system of nano-imprint lithography for IC production,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 214-222, 2002.
• C.-f. Chen , A. Mikelson, R. Engelstad, and E. Lovell, “Transversal response analysis of 200-mm Electron-beam projection lithography masks,” presented at SEM Annual Conference on Experimental and Applied Mechanics, June 10-12, 2002.
• A. Mikelson, C.-f. Chen, R. Engelstad, and E. Lovell, "Vibrational analysis of 8-in EPL masks to optimize plasma cleaning," presented at SPIE's 26th Annual International Symposium on Microlithography, San Jose, CA, Feb. 25- Mar. 2, 2001.
• C.-f. Chen and K. Yuan, “Partial linearization control of a single-link flexible manipulator including third-order motor dynamics,” 8th Nat. Conf. on Mech. Eng., CSME, Taipei, Nov. 24, 1991.

Conference Abstracts

• C.-f. Chen and K. L. Drew, “ Predictions of Miniaturized Microdialysis Probes Performance,” the 12th International Conference on in vivo methods, Vancouver, Canada, Aug. 10-14, 2008.
• C.-f. Chen and K. L. Drew, “Droplet-based Microdialysis and Estimation of Saturation Times,” MSB 2007: 20th International Symposium on Microscale Bioseparations, Vancouver, Canada, Jan. 13-18, 2007.
• C.-f. Chen and K. L. Drew, “Interstitial Diffusion and Combined Drifting Motion of Brownian Particles – Modeling Toward Miniaturization of Microdialysis Probes,” 7th World Congress on Computational Mechanics, Los Angeles, California, July 16 – 22, 2006.
• C.-f. Chen and K. L. Drew, “Interstitial Diffusion and Combined Drifting Motion of Brownian Particles – Modeling Toward Miniaturization of Microdialysis Probes,” 6th Annual Specialized Programs in Neuroscience Research (SNRP) Conference, Fairbanks, Alaska, May 31 – June 2, 2006
• C.-f. Chen , B. T. Rasley, and K. L. Drew, “A diffusion-advection model toward performance characterization of a miniaturized microdialysis probe,” the 60th ACS Northwest Regional / SCHB Meeting, Fairbanks, Alaska, June 15-18, 2005, p.53.

Presentations

• “CNT Structure Laboratory,” Defense Microelectronics Activities (DMEA) Program Review Symposium, 2005.
• “Review of Microneedle Design for Microdialysis,” CNT seminar, Feb. 26, 2004.

Teaching

• In the spring semester of 2008 Cheng-fu is teaching ME 487 Senior Design and ME 493/693 Introductions to Microfluidics. (My teaching materials are posted on the UAF Blackboard.)
• In the fall semester of 2008, Cheng-fu will be teaching ES 331 Mechanics of Materials and ME 631 Advanced Mechanics of Materials.

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