Dr. Cheng-fu Chen
Assistant Professor
Department of Mechanical Engineering
University of Alaska Fairbanks

Phone: (907) 474-7265
Fax: (907) 474-6141
Office: 349D Duckering Building
e-mail: ffcc@uaf.edu

biosketch (pdf, 128 kb)

(Left: 2/14/2004. I and Anastasia. She was not very happy because I grabbed her from the playground for taking this picture. Seen in the background is the Woodriver Elementary School, Fairbanks, AK, where she is a kindergartener. Right: 9/21/2007: A picture of Anastasias taken on a sunny weekend at the front yard.)

(This page was last updated on September 30, 2008.)

Dr. Chen joined the University of Alaska Fairbanks in the cold, dark winter of 2002 and embarked on two new research programs, the reliability of electronic packaging and miniaturization of microdialysis. Prior to working at UAF Dr. Chen was a postdoctoral research fellow working on the photomask stability in the Computational Mechanics Center at the University of Wisconsin, Madison from 2000-2002.

In the electronic packaging reliability project, he has been focusing on the influence of underfill filler settling on the lifetime of solder interconnects as well as on the distribution of the die/underfill interfacial stresses that have direct impact on die delamination/cracking. Currently he is working on the effects of acceleration and mechanical shock on electronic systems, particularly, 3D stacked chips. The research is aimed at improving the reliability of stacked Chip Scale Packaging (s-CSP) modules for commercial as well as space and military applications. He is also working on material models of optimizing the underfill properties.

In the microfluidics project Dr. Chen has been working on the miniaturization of microdialysis with Dr. Kelly Drew. Of some successful milestones he has achieved include one pending patent. He is working on some prototypes to prove the concept of droplet-based microdialysis.

He also looks into the feasibility of employing control theories of stability to the studies of the circumpolar biodiversity and resilience.

Dr. Chen earned his B.S. and M.S. degrees in Mechanical Engineering from the National Taiwan University in 1988 and 1990, and his Ph.D. degree in Mechanical Engineering from the University of Wisconsin, Madison in 2000.

Patent

Refereed Journal Papers ( UAF students names are underlined)

Book Chapter

Refereed Conference Articles ( UAF students names are underlined)

Conference Abstracts

Presentations

Teaching


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