Dr. Cheng-fu Chen Assistant Professor Department of Mechanical Engineering University of Alaska Fairbanks Phone: (907) 474-7265 Fax: (907) 474-6141 Office: 349D Duckering Building e-mail: ffcc@uaf.edu biosketch (pdf, 128 kb)

(Left: 2/14/2004. I and Anastasia. She was not very happy because I grabbed her from the playground for taking this picture. Seen in the background is the Woodriver Elementary School, Fairbanks, AK, where she is a kindergartener. Right: 9/21/2007: A picture of Anastasias taken on a sunny weekend at the front yard.)

(This page was last updated on September 30, 2008.)

Dr. Chen joined the University of Alaska Fairbanks in the cold, dark winter of 2002 and embarked on two new research programs, the reliability of electronic packaging and miniaturization of microdialysis. Prior to working at UAF Dr. Chen was a postdoctoral research fellow working on the photomask stability in the Computational Mechanics Center at the University of Wisconsin, Madison from 2000-2002.

In the electronic packaging reliability project, he has been focusing on the influence of underfill filler settling on the lifetime of solder interconnects as well as on the distribution of the die/underfill interfacial stresses that have direct impact on die delamination/cracking. Currently he is working on the effects of acceleration and mechanical shock on electronic systems, particularly, 3D stacked chips. The research is aimed at improving the reliability of stacked Chip Scale Packaging (s-CSP) modules for commercial as well as space and military applications. He is also working on material models of optimizing the underfill properties.

In the microfluidics project Dr. Chen has been working on the miniaturization of microdialysis with Dr. Kelly Drew. Of some successful milestones he has achieved include one pending patent. He is working on some prototypes to prove the concept of droplet-based microdialysis.

He also looks into the feasibility of employing control theories of stability to the studies of the circumpolar biodiversity and resilience.

Dr. Chen earned his B.S. and M.S. degrees in Mechanical Engineering from the National Taiwan University in 1988 and 1990, and his Ph.D. degree in Mechanical Engineering from the University of Wisconsin, Madison in 2000.

Patent

• Cheng-fu Chen, Kelly L. Drew “ Digital microdialysis by operating droplets in a miniaturized probe,” provisional patent pending, July 20, 2006 (No. 60/831,924).

Refereed Journal Papers ( UAF students names are underlined)

• C.-f. Chen, “A quick comment on ‘Effects of disturbed flow on endothelial cells’,” Ann. Biomed. Eng, in review, 2008.
• C.-f. Chen, “A batch process for collision detection of moving convex polygons,” ASME J. Computing and Information Science in Engineering, in review, 2008.
• C.-f. Chen and D. Peterson, “Board-level drop impact dynamics of stacked CSP module – an Elastic Analysis, “IEEE Trans. Components and Packaging Technologies, in review, 2008.
• D. Peterson and C.-f. Chen, “Board-level drop impact response of lead-free stacked CSPs by finite element analysis,” IEEE Trans. Advanced Packaging, in review, 2008.
• C.-f. Chen and K. L. Drew, “Droplet-based microdialysis –concept, theory, and design consideration,” in press, J. Chromatogr. A., 2008. doi:10.1016/j.chroma.2008.09.006.
• C.-f. Chen and P. C. Karulkar, “Dependence of flip chip solder reliability on filler settling,” IEEE Trans. Advanced Packaging, accepted, 2008.
• C.-f. Chen, “Effect of underfill filler settling on thermomechanical fatigue analysis of flip-chip eutectic solders,” Microelectronics Reliability, 48, pp. 1040-1051, 2008. doi:10.1016/j.microrel.2008.03.022.
• C.-f. Chen and P. C. Karulkar, “Underfill filler settling effect on the die backside interfacial stresses of flip chip packages,” ASME J. Electron. Packag., 130 (3), pp. 031005-1-10, 2008. doi:10.1115/1.2957324.
• S. Guruzu, M. Kulkarni, S. Ingole, G. Xu, C.-f. Chen, H. Liang, “Friction induced crystalline phase on Si,” Wear, Vol. 259, pp. 524-528, 2005.
• A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Microfludic simulations for immersion lithography,” J. Microlithogr. Microfabrication, Microsyst., Vol. 3, pp. 28-34, 2004.
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay performance for electron-projection lithography mask,” J. Microlithogr. Microfabrication, Microsyst., Vol. 2, pp.148-156, 2003.
• C-.f. Chen , R. Engelstad, E. Lovell, D. White, O. Wood, M. Smith, and L. Harriott, “Adaptive alignment of photomasks for overlay improvement,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3099-3105, 2002
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, T. Bayer, J. Greschner, S. Kalt, H. Weiss, O. Wood, and R. Mackay, “ Electron projection lithography mask format layer stress measurement and simulation of pattern transfer distortion,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3053-3057, 2002.
• C.-f. Chen , R . Engelstad, E. Lovell, and A. Novembre , “Simulating the response of electron-beam projection lithography masks under standardized mounting techniques,” Journal of Vacuum Science and Technology B, Vol. 19 , pp 2646-2651, 2001.
• A. Jachim, C.-f. Chen , R. Engelstad, and E. Lovell , “ Simulating the mechanical response of electron-beam projection lithography masks ,” Journal of Vacuum Science and Technology B, 18, pp 3248-3253, 2000.

Book Chapter

• C.-f. Chen and J. Lee, “Heterogeneous-medium transport and propagation,” accepted for publication in the Encyclopedia of Nanoscience and Nanotechnology, Journal of Nanoscience and Nanotechnology.  (2007)

Refereed Conference Articles ( UAF students names are underlined)

• C.-f. Chen, “Constitutive law and quantification of miniaturized microdialysis,” The 6th International Conference on Nanochannels, Microchannels and Minichannels, Darmstardt, Germany, June 23-25, 2008, ICNMM2008-62346.
• C.-f. Chen, and P. Karulkar, “Influence of filler settling on the analysis of solder reliability of flip chip packaging,” Proceedings of the 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008, pp. 1719-1723.
• D. Peterson, C.-f. Chen, and P. Karulkar, “Characterization of drop impact survivability of a 3D CSP stack module,” Proceedings of the 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008, pp. 1648-1653.
• C.-f. Chen “Collision Detection of Moving Polygonal Mobile Robots,” Joint North America, Asia-Pacific ISTVS Conference and Annual Meeting of Japanese Society for Terramechanics, Fairbanks, AK, June 22-24, 2007.
• C.-f. Chen and N. K. Thammadi, “Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging,” Proceedings of the 11th International Symposium on Advanced Packaging Materials, March 15-17, Atlanta, GA, 2006, pp. 51-56.
• C.-f. Chen, N. K. Karri, and B. R. Bracio, “Influence of Electromigration on the Reliability of Micro Switches,” Proceedings of the Seventh VLSI Packaging Workshop of Japan Technical Digest, Kyoto, Japan, Nov. 30-Dec. 2, 2004, pp. 137-140.
• A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Preliminary microfluidic simulation for immersion lithography,” Proceedings of the 2003 SPIE Symposium on Emerging Lithography VI, Vol. 5040, pp. 713-723, 2003.
• C.-f. Chen, “Energy Efficient Routing for Clustered Wireless Sensors Network,” the 29th Annual Conference of the IEEE Industrial Electronics Society (IECON), Roanoke, VA, pp. 1437-1140, 2003.
• P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay and CD uniformity for the electron projection lithography mask,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 547-558, 2002.
• D. White, O. Wood, C.-f. Chen, E. Lovell, and R. Engelstad, “A complete system of nano-imprint lithography for IC production,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 214-222, 2002
• C.-f. Chen, A. Mikelson, R. Engelstad, and E. Lovell, “Transversal response analysis of 200-mm Electron-beam projection lithography masks,” presented at SEM Annual Conference on Experimental and Applied Mechanics, June 10-12, 2002.
• A. Mikelson, C.-f. Chen, R. Engelstad, and E. Lovell, "Vibrational analysis of 8-in EPL masks to optimize plasma cleaning," presented at SPIE's 26th Annual International Symposium on Microlithography, San Jose, CA, Feb. 25-Mar. 2, 2001.
• C.-f. Chen and K. Yuan, “Partial linearization control of a single-link flexible manipulator including third-order motor dynamics,” 8th Nat. Conf. on Mech. Eng., CSME, Taipei, Nov. 24, 1991.

Conference Abstracts

• C.-f. Chen and K. L. Drew, “ Predictions of Miniaturized Microdialysis Probes Performance,” in Proceedings of the 12th International Conference on In Vivo methods, Vancouver, Canada, Aug. 10-14, 2008, pp.29-31.
• C.-f. Chen and K. L. Drew, “Droplet-based Microdialysis and Estimation of Saturation Times,” MSB 2007: 20th International Symposium on Microscale Bioseparations, Vancouver, Canada, Jan. 13-18, 2007, p.71.
• C.-f. Chen and K. L. Drew, “Interstitial Diffusion and Combined Drifting Motion of Brownian Particles – Modeling Toward Miniaturization of Microdialysis Probes,” 7th World Congress on Computational Mechanics, Los Angeles, California, July 16 – 22, 2006.
• C.-f. Chen and K. L. Drew, “Interstitial Diffusion and Combined Drifting Motion of Brownian Particles – Modeling Toward Miniaturization of Microdialysis Probes,” 6th Annual Specialized Programs in Neuroscience Research (SNRP) Conference, Fairbanks, Alaska, May 31 – June 2, 2006, p.72.
• C.-f. Chen, B. T. Rasley, and K. L. Drew, “A diffusion-advection model toward performance characterization of a miniaturized microdialysis probe,” the 60th ACS Northwest Regional / SCHB Meeting, Fairbanks, Alaska, June 15-18, 2005, p.53.

Presentations

• “CNT Structure Laboratory,” Defense Microelectronics Activities (DMEA) Program Review Symposium, 2005.
• “Review of Microneedle Design for Microdialysis,” CNT seminar, Feb. 26, 2004.

Teaching

• In the spring semester of 2008 Cheng-fu taught ME 487 Senior Design and ME 493/693 Introductions to Microfluidics.
• In the fall semester of 2008, I am teaching ES 331 Mechanics of Materials and ME 631 Advanced Mechanics of Materials. (My teaching materials are posted on the UAF Blackboard.)