Publications

	2006
•	“Modeling Thermal Stresses in 3D IC Inter-wafer Interconnects”, J. Zhang, M. Bloomfield, J-Q Lu, R. J. Gutmann, and T. S. Cale, IEEE Transactions on Semiconductor Manufacturing,19(4), 2006, 437- 447
	2005
•	“Modeling Thermal Stresses of Copper Interconnects in Multilayer Structures”, Daniel N. Bentz, Jing Zhang , M.O. Bloomfield, J.-Q. Lu, R.J. Gutmann, and T.S. Cale, in FEMLAB Conference 2005, October 23-25, 2005, Boston, MA
•	“Thermal Stresses in 3D IC Inter-wafer Interconnects”, Jing Zhang , Max O. Bloomfield, Jian-Qiang Lu, Ronald J. Gutmann, and Timothy S. Cale, Micro. Eng. in press
•	“Modeling Thermal Stresses in 3D IC Interwafer Vias ”, D.N. Bentz, J. Zhang, M. Bloomfield, J.Q. Lu, R.J. Gutmann and T.S. Cale, 2005 VMIC - VLSI/ULSI Multilevel Interconnection Conference, October 3 - 6, 2005, Fremont, CA
•	“Thermally Induced Stresses in 3D ICs”, J. Zhang , M.O. Bloomfield, J.-Q. Lu, R.J. Gutmann, and T.S. Cale, in Advanced Metallization Conference (AMC) 2005 , September 27- 29, 2005, Colorado Springs, CO
•	“A Finite Element Study of Thermal Stress in 3D IC Structures”, J. Zhang , M.O. Bloomfield, J.-Q. Lu, R.J. Gutmann, and T.S. Cale, in the AVS 6th International Conference on Microelectronics and Interfaces (ICMI'05) , March 21-23, 2005, Santa Clara, CA
•	“Thermal Stress in 3D IC Interwafer Interconnects”, J. Zhang , M.O. Bloomfield, J.-Q. Lu, R.J. Gutmann, and T.S. Cale, in MAM2005- Materials for Advanced Metallization Conference, March 6-9, 2005, Dresden,Germany
	2004
•	“Temperature Evolution During Field Activated Sintering”, Antonios Zavaliangos, Jing Zhang , Martin Krammer and Joanna Groza, Materials Science and Engineering A, 379 (1-2), 2004, 218-228
•	“A Numerical Analysis of Anisotropy and Compaction Mode Effects on the Thermal Conductivity of Compacts”, Jing Zhang, Antonios Zavaliangos, in Advances in Powder Metallurgy & Particulate Materials-2004. Proceedings of the 2004 International Conference on Powder Metallurgy and Particulate Materials, pp. 1-54-65, 13-17 June 2004 , Chicago, IL, USA, Metal Powder Industries Federation, Princeton, NJ, USA
	2003
•	“A Model for Simulation of Temperature Field Evolution in Field Activated Sintering”, Jing Zhang , Antonios Zavaliangos, and Joanna Groza, in Proceedings Sintering 2003, R.G. Cornwall, R.M. German, and G.L. Messing (eds.), Materials Research Institute, Pennsylvania State University, University Park, PA, (http://www.mri.psu.edu/conferences/sint03/pdf/Zhang_2_4.pdf), no page numbers, September 14-17, 2003
•	(Invited paper) “Field Activated Sintering Technique: A Contrast and Comparison”, Jing Zhang , Antonios Zavaliangos, and Joanna Groza, P/M Science and Technology Brief,  5(4), 5-8, 2003
•	“Awardee Report of CPMT/Axel Madsen Scholarship”, Jing Zhang, International Journal of Powder Metallurgy,39 (5), 48-49, 2003
•	“The Effect of Specimen Conductivity on Current and Temperature Distribution in Field Activated Sintering”, Jing Zhang , Antonios Zavaliangos, and Joanna Groza, in Advances in Powder Metallurgy and Particulate Materials, Proceedings of PM2TEC2003: International Conference on Powder Metallurgy and Particulate Materials, R. Lawcock and M. Wright (eds.), Las Vegas, NV, pp. 4-89 – 4-99, June 8-12, 2003
	2002
•	J. Zhang, A. Zavaliangos, “Discrete Element Simulation of Transient Thermo electrical Phenomena in Particulate System”, in Granular Material-Based Technologies, MRS Proceedings Volume 759, S. Sen, M.L. Hunt, and A.J. Hurd (eds.) MRS Fall Meeting 2002, Boston, MA, abstract only, December 2-6, 2002
•	“Finite Element Simulation of the Temperature Field in Electric Current Aided Sintering”, Jing Zhang , Antonios Zavaliangos, Martin Kraemer, and Joanna Groza, in Process Modeling in Powder Metallurgy & Particulate Materials: Proceedings of the 2002 International Conference on Process Modeling Powder Metallurgy & Particulate Materials, A. Lawley, J. E. Smugeresky and L. Smith (eds.), Newport Beach, CA, pp. 208 – 215, October 28-29, 2002
•	“Numerical Simulation of Thermal-electrical Phenomena in Field Activation Sintering”, Jing Zhang , Antonios Zavaliangos, Martin Kraemer, and Joanna Groza, in Modelling the Performance of Engineering Structural Materials III; Proceedings of the TMS Fall Meeting 2002, D.R. Lesuer, T.S. Srivatsan, and E.M. Taleff (eds.), Columbus, OH, pp. 299-309, October 7-10, 2002
	Before 2001
•	“Study on Forming Limit Stress Diagram (FLSD)”, Jing Zhang , Xianbin Zhou, in Proceedings of 7th National Conference of Society of Stamping and Forging, X-B Zhou (eds.), Society of Stamping and Forging, Changsha, China, pp. 299-302, (in Chinese), August 10, 1999 (in Chinese)